data sheet semiconductor http://www.yeashin.com 1 rev.02 20141224 YSESDAXXCT series bidirectional tvs diode applications cell phone handsets and accessories microprocessor based equipment personal digital assistants (pda?s) notebooks, desktops, and servers portable instrumentation peripherals pagers iec compatibility iec61000-4-2 (esd) 30kv (air), 30kv (contact) iec61000-4-4 (eft) 40a (5/50 s) sod-523 features 100 watts peak pulse power per line (tp=8/20 s) protects one bidirectional i/o line low clamping voltage working voltages : 3.3v, 5v and 8v low leakage current mechanical characteristics sod-523 package molding compound flammability rating : ul 94v-o weight 2.0 millgrams (approximate) quantity per reel : 3,000pcs reel size : 7 inch lead finish : lead free pin configuration h
http://www.yeashin.com 2 rev.02 20141224 device characteristics YSESDAXXCT series (v) (v) @1a ( a) (pf) (max.) (min.) (ma) (max.) (max.) (@a) (max.) (typ.) dt 5 6 1 9.8 ysesda33ct ct 3.3 4 1 7 12 8 1 10 20 5 1 10 ysesda08ct gt 8 8.5 1 17.5 25 3 1 7 ysesda05ct v b part number device marking v rwm t l 260 (10 sec.) lead soldering temperature operating temperature range electrical characteristics per line (@ 25 unless otherwise specified) v c i r c t v c i t watts parameter symbol value 100 p pp storage temperature range t stg -55 ~ 150 units peak pulse power (tp=8/20s waveform) t j -55 ~ 150 maximum ratings (@ 25 unless otherwise specified) maximun p pk dissipation@t a =25 (pw =8/20 s ) (note 1) p pk 100 w dc power dissipation @tl=75 (note 2) derate above 75 thermal resistance,jun c tion - to - lead pd r j l 700 8 50 mw mw/ /w dc power dissipation @ta=25 (note 2) derate above 25 thermal resistance, junction - to - ambient pd r j a 5 00 4 2 50 mw mw/ /w note 1. non - repetitive current pulse at t a =25 , power waveform = 8/20 s. note 2. mounted with 1 inch copper pad size, dc board fr - 4.
http://www.yeashin.com 3 rev.02 20141224 device characteristics YSESDAXXCT series figure 3 . 8/20 s pulse waveform figure 4 . steady state power derate rating
http://www.yeashin.com 4 rev.02 20141224 package outline & dimensions YSESDAXXCT series * soldering footprint
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